|
| Test Item |
|
Test Condition |
|
Test Result |
|
|
|
|
|
Shock Resistance
(Drop) |
|
Natural drop on a hard wood board
from
a height of 75cm, three times |
|
Frequency and waveform of tested
products must remain within
specifications. |
|
|
|
|
|
| Vibration |
|
Vibration with amplitude of 0.762mm
and sweep time of 1 minute at 10
to 55Hz for 2 hours on x,y and z axis |
|
Frequency and waveform of tested
products must remain within
specifications. |
|
|
|
|
|
| Lead Strength |
|
Lead Pull : 0.9 kg downward for 3 sec.
Lead Bend : Maximum bend of
90°
reference to base for 2 bends |
|
There should be no distortion in
appearance. |
|
|
|
|
|
| Solderability |
|
Dipping in solder(230° ±5°C) for 5 sec. |
|
95% of the coated solder surface is
uniform and free from breaks and
pinholes. |
|
|
|
|
|
Resistance to
Solder
Heat |
|
Dipping in solder(260° ±5°C) for 10 sec. |
|
Frequency and waveform of tested
products must remain within
specifications. |
|
|
|
|
|
| Temperature
Cycle |
|
Thermal shock of 3 cycles of dwell in
baths of -40°C for 30min.,
+25°C for
15min., +85°C for 30min.,
+25°C for
15min. |
|
Frequency and waveform of tested
products must remain within
specifications. |
|
|
|
|
|
| Moisture
Resistance |
|
Exposure to temperature of +40°C and
humidity of 90% RH for 96 hours |
|
Frequency and waveform of tested
products must remain within
specifications with no
significant
rusting. |
|
|
|
|
|
| Aging |
|
30 days @ 85° C or 7 days @ 105°C |
|
Deviation of frequency must be less
than ±5ppm or custom specification. |
|
|
|
|
|
| Hermetical Seal |
|
Fine Leak :
Measurement with mass spectrometer
Gross Leak :
Test in de-ionized H2O. |
|
Leak rate less than 2x10-8 Atmos
CC/sec. of Helium
Air bubble would not be found in
de-ionized H2O. |
|
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